| M3 III | M6 III | |
| 對(duì)象電路板尺寸（L*W） | 雙軌：48mm*48mm-534mm*510mm；單軌：48mm*48mm-534mm*510mm | |
| 元件搭載數(shù) | 最多20種（以8mm計(jì)算） | 最多45種（以8mm計(jì)算） |
| 電路板加載時(shí)間 | 雙軌：連續(xù)運(yùn)行0秒；單軌：M3III 2.5秒，M6III 3.4秒 | |
| 可搭載工作頭 | H24; V12/H12HS; H08M; H08; H04S(F)/H04; H02(F); H01/OF; G04(F) | H24; V12/H12HS; H08M; H08; H04S(F)/H04; H02(F); H01/OF; G04(F) |
| 貼裝位置精度/涂覆精度 | H24:±0.035mm; V12/H12HS:±0.038mm; H08M:±0.04mm; H08:±0.04mm; H04S(F)/H04:±0.04mm; H02(F):±0.03mm; H01/OF:±0.03mm; G04(F):±0.04mm | |
| 生產(chǎn)能力 | H24:35000CPH; V12/H12HS:26000CPH/24500CPH; H08M:13000CPH; H08:11500CPH; H04S(F)/H04:10500CPH/9500CPH; H02(F):5500CPH/6700CPH; H01/OF:4200CPH/3000CPH; G04(F):7500CPH | |
| 對(duì)象元件 | H24:03015-5.0*5.0mm; V12/H12HS:0402-7.5*7.5mm; H08M:0603-45*45mm; H08:0402-12*12mm; H04S(F)/H04:1608-38*38mm; H02(F):1608-74*74MM(32*180mm); H01/OF:1608-74*74MM(32*162mm); G04(F):0402-15*15mm | |
| 模組寬度 | 320mm | 645mm |
| 元件供應(yīng)裝置 | ||
| 智能供料器 | 對(duì)應(yīng)4.8.12.16.24.32.44.56.72.88.104mm寬度料帶 | |
| 管狀供料器 | 單管或3管 | |
| 料盤(pán)單元 | 對(duì)應(yīng)13.5*322.6mm（JEDEC規(guī)格）（料盤(pán)單元），276*330mm(料盤(pán)單元-LT),143*330mm(料盤(pán)單元-LTC） | |
